Study of the effects of laser micro structuring on grinding of silicon nitride ceramics: Bahman Azarhoushang, Babak Soltani, Amir Daneshi / Goverdham D. Lahoti (1) STC G, 67/1/2018, P.329 : Keywords: Laser assisted grinding, Silicon nitride, Specific grinding energy, Ultra-short pulsed laser, Laser energy, Single grain cutting
An experimental investigation into micro ball end-milling of silicon. By Muhammad Arif Rahman. Analytical modeling of ductile-regime machining of tungsten carbide by endmilling. By Muhammad Arif. A review on the current research trends in ductile regime machining. By M. Rahman and dennis Neo.
： A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness. In this paper, the grinding marks formation mechanism was clarified, a grinding marks formation ...
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. A phenomenon commonly encountered in grinding of silicon wafers is the grinding marks, which are difficult to remove by subsequent polishing process, and have been a great obstacle to the manufacture of silicon wafers with higher flatness.
Huo, FW, Kang, RK, Li, Z, et al. Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. Int J Mach Tools Manuf 2013; 66: 54 – 65. Google Scholar | Crossref
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The wafer grinding by use of fixed abrasive diamond wheels is required to create a high-quality wafer surface in a short time. In general, it is known that the grinding performance of diamond wheel is mainly dependent on grinding wheel specifications and grinding conditions. The cutting edge distribution or abrasive protrusion height in depth-wise of a specified wheel is one of the most ...
The grinding technology for advanced materials such as optical glass, WC, ceramics and silicon has substantially grown with the widespread use of precision components made of such materials in various applications like micro lenses, semiconductor components, automobile diesel injectors, and magnetic heads for computers etc. Applications of ...
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About. CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems.This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers.
Keywords: Ultra-precision, Grinding, Chemical action assistance : Abstract : Higher accuracy and more efficient production of large aperture glass lenses is increasingly required for high-resolution imaging devices. These glass lenses are typically manufactured by both ultra-precision grinding and polishing.
Subsurface damage (SSD) and grinding damage-induced stress (GDIS) are a focus of attention in the study of grinding mechanisms. Our previous study proposed a load identification method and analyzed the GDIS in a silicon wafer ground (Zhou et al., 2016, "A Load Identification Method for the GDIS Distribution in Silicon Wafers," Int. J. Mach. Tools Manuf., 107, pp. 1–7.).
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Grinding marks are regard as a great obstacle to manufacture spherical and aspheric surfaces with higher surface quality, lower energy and wastage. The scallop-height was studied for optimizing the grinding parameters firstly to reduce its effect on grinding marks. Secondly, the expression of grinding points distribution was established to characterize the grinding marks …
High-precision optical components with complex shapes or microstructures have been extensively used in numerous fields such as biomedicine, energy and aerospace. In order to accurately achieve the specific functions of the components, the form accuracy and uniform surface quality need to reach an ever-high level. To achieve this, ultra-precision normal grinding is used for machining various ...
This phenomenon, which is typical in turbomachinery, is referred to as ice shedding. The ice shedding phenomenon is very complicated because there are several unknown physical properties of ice, such as the ice density, the adhesion force between accreted ice …
Therefore, grinding marks have significant impact on site flatness and nanotopography of the final polished silicon wafers, and have been a great obstacle to the production of ultra flat wafers [6 ...
Every aspect of the grinding process--techniques, machines and machine design, process control, and productivity optimization aspects--come under the searchlight. The new edition is an extensive revision and expansion of the first edition covering all the latest developments, including center-less grinding and ultra-precision grinding.
Huo F W, Kang R K, Li Z and Guo D M 2013 Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers Int. J. Mach. Tool Manuf. 66 54–65 Crossref Google Scholar [158]
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Request PDF | On Mar 1, 2013, F.W. Huo and others published Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers | Find, read and cite all the research ...
A predictive model of grinding force in silicon wafer self-rotating grinding: M.W. Fu · J.L. Wang · A.M. Korsunsky · A.M. Korsunsky Relationship between temperature at cut front edge and kerf quality in fiber laser cutting of Al–Cu aluminum alloy: Mujian Xia · Dongdong Gu · Guanqun Yu · Donghua Dai · Hongyu Chen · Qimin Shi · Qimin Shi
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dance with the rules of layout. A silicon wafer provides the basis of the integrated circuit. Wafers are processed using a grinding process that produces a flat surface that is still conductive at this stage. The wafer is insulated by growing a thermal oxide layer so that leakage of current between transistors is prevented. A conducting layer is
An advanced polishing technique of ion polishing has been used to process silicon wafers. This high-level stability and the precision process can achieve the roughness Ra 0.231nm at the finishing optical surfaces. Preview abstract
Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers FW Huo, RK Kang, Z Li, DM Guo International Journal of Machine Tools and Manufacture 66, 54-65, …
Advances in Mechanical Engineering, Volume 13, Issue 10, October 2021.
Back Grinding of Wafer with Outer Rim (BGWOR) is a novel method for carrier-less thinning of silicon wafers. Silicon wafers are widely used in integrated circuits (ICs). The...
The rotation speed ratio (RSR) is an important parameter influencing the surface waviness features in the parallel grinding process, which equals the ratio of the grinding wheel's rotation speed N g and the workpiece's rotation speed N w, as described in Equation (3) [].When RSR is integer, the peaks and valleys of the circular waviness profiles generated during all the revolutions of the ...
Kuroda Precision Industries ltd. KURODA HISTORY 90 information. Kuroda Precision Industries is manufacturer of precision equipments and machines of Japan. We manufacture such as Precision Ball Screws,Ballscrew Actuators,Press Tools,Surface Grinding Machine,Gauges,Ultra Precision Surface Configuration Measuring systems and etc.
Modeling of Vibration Condition in Flat Surface Grinding Process › journals by A Gasagara - 2020 Feb 10, 2020 - This article presents a new model of the flat surface grinding process vibration conditions.
Zurück zum Zitat Huo F, Kang R, Li Z, Guo D (2013) Origin, modeling and suppression of grinding marks in ultra-precision grinding of silicon wafers. Int J Mach Tool Manu 66:54–65. https:// doi. org/ 10. 1016/ j. ijmachtools. 2012. 11.
to attain thinning wafer or silicon wafers an ultra-precision grinding machine [1] should carry it out. Nowadays, several issues and requirements are encountered during proliferation from development to the manufacturing phase. The paper will discuss the several key process requirements to attain stress-free wafer thinning
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